AMD is preparing for the next major leap in processor development: The upcoming Zen 7 architecture, codenamed „Grimlock“ internally, is set to utilize TSMC’s advanced 1.4nm A14 process. A key feature of this new generation is the increase to up to 16 cores per Core Complex Die (CCD). This significant boost in core count per chiplet module marks a crucial milestone in the company’s chiplet strategy and lays the groundwork for massively parallel processing capabilities in future high-end systems.
To handle the immense bandwidth requirements of this dense core arrangement, AMD is relying on innovative packaging technologies. In addition to the introduction of Fan-Out Panel-Level Packaging (FOPLP), the „Elevated Fanout Bridge“ (EFB) interconnect technology will play a pivotal role. This advanced interconnect solution is designed to optimize communication between the numerous cores and other chiplets, which will be critical for the efficiency and speed of Zen 7 processors. Massive investments in Taiwan’s semiconductor ecosystem are supporting this technological development and ensuring the necessary production capacity.
The market rollout of Zen 7 will span a longer timeline, initially targeting the professional sector. While the first Zen 6 server chips are expected by late 2026 and desktop models in 2027, the Zen 7 architecture debut is scheduled for 2028 or potentially early 2029. High-performance EPYC server models will lead the charge, aiming to meet computing demands in enterprise environments and data centers. Consumer desktop availability will follow later, with processors potentially offering up to 32 cores and an impressive 512 MB of cache.
To manage the high costs associated with cutting-edge manufacturing, AMD plans a strategic split in production partners. While the performance-critical compute dies will continue to be manufactured by TSMC, less critical components such as I/O dies are expected to be outsourced to Samsung Foundry. This approach allows AMD to leverage TSMC’s leading-edge technology while achieving cost efficiency through supply chain diversification. This dual-source strategy underscores AMD’s commitment to combining technological excellence with economic sustainability in semiconductor production.