News stories tagged with #EMIB-T
The rapid evolution in Artificial Intelligence (AI) demands massive advancements in semiconductor infrastructure. This shift is being driven by strategic moves from key players like SK hynix, Intel, and AMD. The discussion focuses on the necessity of advanced packaging technologies (such as HBI/EMIB-T) and new architectural standards (Zen 6, PCIe 6.0) to meet the demands of modern AI accelerators.