Combined benchmark scores for both processors
Head-to-head processor comparison
Combined benchmark scores for both processors
Out of 2,060 results in the database
Rank #188
Rank #1,237
Ryzen 9 PRO 3900 wins by 26.3% (Rank #188 vs #1237)
Out of 2,060 results in the database
Rank #228
Rank #1,319
Ryzen 9 PRO 3900 wins by 26.9% (Rank #228 vs #1319)
Out of 2,060 results in the database
Rank #198
Rank #1,014
Ryzen 9 PRO 3900 wins by 25.4% (Rank #198 vs #1014)
Out of 1,771 results in the database
Rank #144
Rank #938
Ryzen 9 PRO 3900 wins by 18.7% (Rank #144 vs #938)
Out of 1,771 results in the database
Rank #138
Rank #937
Ryzen 9 PRO 3900 wins by 20.7% (Rank #138 vs #937)
Out of 1,771 results in the database
Rank #179
Rank #986
Ryzen 9 PRO 3900 wins by 17% (Rank #179 vs #986)
Side-by-side comparison of key specifications
| Specification | Ryzen 9 PRO 3900 | Xeon X5570 | Diff |
|---|---|---|---|
| Cores |
12
|
4
|
+66.7% |
| Threads |
24
|
8
|
+66.7% |
| Base Frequency |
3,100 MHz
|
2,930 MHz
|
+5.5% |
| Clock Multiplier | -- |
22x
|
|
| L1 Cache |
768 KB
|
62 KB
|
+91.9% |
| L2 Cache |
6 MiB
|
0 MiB
|
+95.9% |
| L3 Cache |
64 MiB
|
8 MiB
|
+88.1% |
| Memory Channels |
2
|
3
|
-33.3% |
| Maximum Memory |
128 GB
|
0 GB
|
+99.9% |
| Max Bandwidth |
48 GB/s
|
32 GB/s
|
+32.9% |
| PCIe Lanes |
20
|
16
|
+20% |
| Max CPUs |
1
|
2
|
-50% |
| TDP (lower is better) |
65 W
|
95 W
|
31.6% less |
| Process (lower is better) |
7 nm
|
45 nm
|
84.4% less |
| Specification | Ryzen 9 PRO 3900 | Xeon X5570 |
|---|---|---|
| Designer | AMD | Intel |
| Family | Ryzen | -- |
| Series | 3000 | -- |
| Model Number | PRO | X5570 |
| Microarchitecture | Zen 2 | -- |
| Core Name | Matisse | Gainestown |
| Socket | Socket | FCLGA1366 |
| Package | µOPGA-1331 | FC-LGA8 |
| Memory Type | DDR4-3200 | DDR3 800/1066/1333 |
| ECC Support | No | Yes |
| PCIe Revision | 4.0 | 3 |
| PCIe Configuration | 1x16+x4, 2x8+x4, 1x8+2x4+x4 | 1x16, 2x8, 1x8 2x4 |
| Market Segment | Desktop | Server |
| Locked Multiplier | No | Yes |
Designer
Family
Series
Model Number
Microarchitecture
Core Name
Socket
Package
Memory Type
ECC Support
PCIe Revision
PCIe Configuration
Market Segment
Locked Multiplier
Manufacturing process and die characteristics
| Specification | Ryzen 9 PRO 3900 | Xeon X5570 |
|---|---|---|
| Process | 7 nm | 45 nm |
| Die Area | -- | 263 mm² |
| Transistor Count | -- | 0.00 billion |
| Manufacturer | TSMC | Intel |
| Technology | CMOS | -- |
| Word Size | 64-bit | 64-bit |
| ISA | x86-64 (x86) | -- |
Process
Die Area
Transistor Count
Manufacturer
Technology
Word Size
ISA
Integrated GPU specifications comparison
| Specification | Ryzen 9 PRO 3900 | Xeon X5570 |
|---|---|---|
| GPU | -- | HD Graphics 4600 |
| GPU Designer | -- | Intel |
| GPU Max Frequency | -- | 1150 MHz |
GPU
GPU Designer
GPU Max Frequency
Supported instruction set extensions comparison
| Extension | Ryzen 9 PRO 3900 | Xeon X5570 |
|---|---|---|
| ABM | ||
| ADX | ||
| AES | ||
| AMD-V | ||
| AMD-Vi | ||
| AVX | ||
| AVX-512 | ||
| AVX2 | ||
| AVX512BW | ||
| AVX512CD | ||
| AVX512DQ | ||
| AVX512F | ||
| AVX512VL | ||
| BMI1 | ||
| BMI2 | ||
| Boost 2 | ||
| CLMUL | ||
| EIST | ||
| EMMX | ||
| EPT | ||
| F16C | ||
| FMA | ||
| FMA3 | ||
| FPU | ||
| Flex Memory | ||
| HT | ||
| IPT | ||
| MMX | ||
| MPX | ||
| NX | ||
| Protected | ||
| RdRand | ||
| Real | ||
| SHA | ||
| SIPP | ||
| SMEP | ||
| SMM | ||
| SMT | ||
| SSE | ||
| SSE2 | ||
| SSE3 | ||
| SSE4.1 | ||
| SSE4.2 | ||
| SSE4a | ||
| SSSE3 | ||
| SST | ||
| Secure Key | ||
| SenseMI | ||
| TBT 1.0 | ||
| TBT 2.0 | ||
| TSME | ||
| TSX | ||
| TXT | ||
| VMD | ||
| VT-d | ||
| VT-x | ||
| XFR 2 | ||
| vPro | ||
| x86-16 | ||
| x86-32 | ||
| x86-64 |
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