Combined benchmark scores for both processors
Head-to-head processor comparison
Combined benchmark scores for both processors
Out of 2,060 results in the database
Rank #188
Rank #338
Ryzen 9 PRO 3900 wins by 6.7% (Rank #188 vs #338)
Out of 2,060 results in the database
Rank #228
Rank #367
Ryzen 9 PRO 3900 wins by 5.4% (Rank #228 vs #367)
Out of 2,060 results in the database
Rank #198
Rank #313
Ryzen 9 PRO 3900 wins by 8.6% (Rank #198 vs #313)
Out of 1,771 results in the database
Rank #144
Rank #301
Ryzen 9 PRO 3900 wins by 9.1% (Rank #144 vs #301)
Out of 1,771 results in the database
Rank #138
Rank #297
Ryzen 9 PRO 3900 wins by 9.3% (Rank #138 vs #297)
Out of 1,771 results in the database
Rank #179
Rank #226
Ryzen 9 PRO 3900 wins by 3.2% (Rank #179 vs #226)
Side-by-side comparison of key specifications
| Specification | Ryzen 9 PRO 3900 | Xeon W-2155 | Diff |
|---|---|---|---|
| Cores |
12
|
10
|
+16.7% |
| Threads |
24
|
20
|
+16.7% |
| Base Frequency |
3,100 MHz
|
3,300 MHz
|
-6.1% |
| Turbo Frequency (1 core) | -- |
4,500 MHz
|
|
| Clock Multiplier | -- |
33x
|
|
| L1 Cache |
768 KB
|
640 KB
|
+16.7% |
| L2 Cache |
6 MiB
|
10 MiB
|
-40% |
| L3 Cache |
64 MiB
|
14 MiB
|
+78.5% |
| Memory Channels |
2
|
4
|
-50% |
| Maximum Memory |
128 GB
|
512 GB
|
-75% |
| Max Bandwidth |
48 GB/s
|
79 GB/s
|
-40% |
| PCIe Lanes |
20
|
48
|
-58.3% |
| Max CPUs |
1
|
1
|
0% |
| TDP (lower is better) |
65 W
|
140 W
|
53.6% less |
| Process (lower is better) |
7 nm
|
14 nm
|
50% less |
| Specification | Ryzen 9 PRO 3900 | Xeon W-2155 |
|---|---|---|
| Designer | AMD | Intel |
| Family | Ryzen | Xeon |
| Series | 3000 | W-2000 |
| Model Number | PRO | W-2155 |
| Microarchitecture | Zen 2 | Skylake |
| Core Name | Matisse | Skylake |
| Core Family | -- | 6 |
| Socket | Socket | Socket |
| Package | µOPGA-1331 | FCLGA-2066 |
| Memory Type | DDR4-3200 | DDR4-2666 |
| ECC Support | No | Yes |
| PCIe Revision | 4.0 | 3.0 |
| PCIe Configuration | 1x16+x4, 2x8+x4, 1x8+2x4+x4 | x16, x8, x4 |
| Market Segment | Desktop | Workstation |
| Release Price | -- | $1,440.00 |
| Locked Multiplier | No | Yes |
Designer
Family
Series
Model Number
Microarchitecture
Core Name
Core Family
Socket
Package
Memory Type
ECC Support
PCIe Revision
PCIe Configuration
Market Segment
Release Price
Locked Multiplier
Manufacturing process and die characteristics
| Specification | Ryzen 9 PRO 3900 | Xeon W-2155 |
|---|---|---|
| Process | 7 nm | 14 nm |
| Die Area | -- | 484 mm² |
| Manufacturer | TSMC | Intel |
| Technology | CMOS | CMOS |
| Word Size | 64-bit | 64-bit |
| ISA | x86-64 (x86) | x86-64 (x86) |
Process
Die Area
Manufacturer
Technology
Word Size
ISA
Supported instruction set extensions comparison
| Extension | Ryzen 9 PRO 3900 | Xeon W-2155 |
|---|---|---|
| ABM | ||
| ADX | ||
| AES | ||
| AMD-V | ||
| AMD-Vi | ||
| AVX | ||
| AVX-512 | ||
| AVX-512 | ||
| AVX2 | ||
| AVX512BW | ||
| AVX512CD | ||
| AVX512DQ | ||
| AVX512F | ||
| AVX512VL | ||
| BMI1 | ||
| BMI2 | ||
| Boost 2 | ||
| CLMUL | ||
| EIST | ||
| EMMX | ||
| EPT | ||
| F16C | ||
| FMA3 | ||
| FPU | ||
| HT | ||
| IPT | ||
| MMX | ||
| MPX | ||
| NX | ||
| Protected | ||
| RdRand | ||
| Real | ||
| SHA | ||
| SMEP | ||
| SMM | ||
| SMT | ||
| SSE | ||
| SSE2 | ||
| SSE3 | ||
| SSE4.1 | ||
| SSE4.2 | ||
| SSE4a | ||
| SSSE3 | ||
| SST | ||
| Secure Key | ||
| SenseMI | ||
| TBT 2.0 | ||
| TSME | ||
| TSX | ||
| TXT | ||
| VMD | ||
| VT-d | ||
| VT-x | ||
| XFR 2 | ||
| vPro | ||
| x86-16 | ||
| x86-32 | ||
| x86-64 |
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