Combined benchmark scores for both processors
Head-to-head processor comparison
Combined benchmark scores for both processors
Out of 2,060 results in the database
Rank #188
Rank #2,053
Ryzen 9 PRO 3900 wins by 41.7% (Rank #188 vs #2053)
Out of 2,060 results in the database
Rank #228
Rank #2,052
Ryzen 9 PRO 3900 wins by 47.7% (Rank #228 vs #2052)
Out of 2,060 results in the database
Rank #198
Rank #2,010
Ryzen 9 PRO 3900 wins by 32.8% (Rank #198 vs #2010)
Out of 1,771 results in the database
Rank #144
Number Crunching not available for both processors.
Out of 1,771 results in the database
Rank #138
Data Processing not available for both processors.
Out of 1,771 results in the database
Rank #179
Physics & Compute not available for both processors.
Side-by-side comparison of key specifications
| Specification | Ryzen 9 PRO 3900 | Atom Z670 | Diff |
|---|---|---|---|
| Cores |
12
|
1
|
+91.7% |
| Threads |
24
|
2
|
+91.7% |
| Base Frequency |
3,100 MHz
|
1,500 MHz
|
+51.6% |
| Clock Multiplier | -- |
8x
|
|
| L1 Cache |
768 KB
|
56 KB
|
+92.7% |
| L2 Cache |
6 MiB
|
1 MiB
|
+91.7% |
| L3 Cache |
64 MiB
|
-- | |
| Memory Channels |
2
|
1
|
+50% |
| Maximum Memory |
128 GB
|
2 GB
|
+98.4% |
| Max Bandwidth |
48 GB/s
|
3 GB/s
|
+93.8% |
| PCIe Lanes |
20
|
-- | |
| Max CPUs |
1
|
1
|
0% |
| TDP (lower is better) |
65 W
|
3 W
|
95.4% more |
| Process (lower is better) |
7 nm
|
45 nm
|
84.4% less |
| Specification | Ryzen 9 PRO 3900 | Atom Z670 |
|---|---|---|
| Designer | AMD | Intel |
| Family | Ryzen | Atom |
| Series | 3000 | Z650 |
| Model Number | PRO | Z670 |
| Microarchitecture | Zen 2 | Bonnell |
| Core Name | Matisse | Lincroft |
| Core Family | -- | 6 |
| Core Model | -- | 38 |
| Socket | Socket | BGA-518 |
| Package | µOPGA-1331 | FCBGA-518 |
| Chipset | -- | Langwell |
| Memory Type | DDR4-3200 | DDR-400 and DDR2-800 |
| ECC Support | No | No |
| PCIe Revision | 4.0 | -- |
| PCIe Configuration | 1x16+x4, 2x8+x4, 1x8+2x4+x4 | -- |
| Market Segment | Desktop | Mobile |
| Release Price | -- | $75.00 |
| Locked Multiplier | No | Yes |
Designer
Family
Series
Model Number
Microarchitecture
Core Name
Core Family
Core Model
Socket
Package
Chipset
Memory Type
ECC Support
PCIe Revision
PCIe Configuration
Market Segment
Release Price
Locked Multiplier
Manufacturing process and die characteristics
| Specification | Ryzen 9 PRO 3900 | Atom Z670 |
|---|---|---|
| Process | 7 nm | 45 nm |
| Die Area | -- | 65 mm² |
| Transistor Count | -- | 0.00 billion |
| Manufacturer | TSMC | Intel |
| Technology | CMOS | CMOS |
| Word Size | 64-bit | 32-bit |
| ISA | x86-64 (x86) | x86-32 (x86) |
Process
Die Area
Transistor Count
Manufacturer
Technology
Word Size
ISA
Integrated GPU specifications comparison
| Specification | Ryzen 9 PRO 3900 | Atom Z670 |
|---|---|---|
| GPU | -- | PowerVR |
| GPU Designer | -- | Imagination |
GPU
GPU Designer
Supported instruction set extensions comparison
| Extension | Ryzen 9 PRO 3900 | Atom Z670 |
|---|---|---|
| ABM | ||
| ADX | ||
| AES | ||
| AMD-V | ||
| AMD-Vi | ||
| AVX | ||
| AVX-512 | ||
| AVX2 | ||
| AVX512BW | ||
| AVX512CD | ||
| AVX512DQ | ||
| AVX512F | ||
| AVX512VL | ||
| BMI1 | ||
| BMI2 | ||
| BPT | ||
| Boost 2 | ||
| CLMUL | ||
| EIST | ||
| EMMX | ||
| EPT | ||
| F16C | ||
| FMA3 | ||
| FPU | ||
| HT | ||
| IPT | ||
| MMX | ||
| MPX | ||
| NX | ||
| Protected | ||
| RdRand | ||
| Real | ||
| SHA | ||
| SMEP | ||
| SMM | ||
| SMT | ||
| SSE | ||
| SSE2 | ||
| SSE3 | ||
| SSE4.1 | ||
| SSE4.2 | ||
| SSE4a | ||
| SSSE3 | ||
| SST | ||
| Secure Key | ||
| SenseMI | ||
| TBT 2.0 | ||
| TSME | ||
| TSX | ||
| TXT | ||
| VMD | ||
| VT-d | ||
| VT-x | ||
| XFR 2 | ||
| vPro | ||
| x86-16 | ||
| x86-32 | ||
| x86-64 |
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