Combined benchmark scores for both processors
Head-to-head processor comparison
Combined benchmark scores for both processors
Out of 2,060 results in the database
Rank #188
Rank #2,055
Ryzen 9 PRO 3900 wins by 41.9% (Rank #188 vs #2055)
Out of 2,060 results in the database
Rank #228
Rank #2,054
Ryzen 9 PRO 3900 wins by 48% (Rank #228 vs #2054)
Out of 2,060 results in the database
Rank #198
Rank #2,020
Ryzen 9 PRO 3900 wins by 33.1% (Rank #198 vs #2020)
Out of 1,771 results in the database
Rank #144
Rank #1,768
Ryzen 9 PRO 3900 wins by 21.9% (Rank #144 vs #1768)
Out of 1,771 results in the database
Rank #138
Rank #1,770
Ryzen 9 PRO 3900 wins by 23.7% (Rank #138 vs #1770)
Out of 1,771 results in the database
Rank #179
Rank #1,771
Ryzen 9 PRO 3900 wins by 20% (Rank #179 vs #1771)
Side-by-side comparison of key specifications
| Specification | Ryzen 9 PRO 3900 | Atom 230 | Diff |
|---|---|---|---|
| Cores |
12
|
1
|
+91.7% |
| Threads |
24
|
2
|
+91.7% |
| Base Frequency |
3,100 MHz
|
1,600 MHz
|
+48.4% |
| Clock Multiplier | -- |
12x
|
|
| L1 Cache |
768 KB
|
56 KB
|
+92.7% |
| L2 Cache |
6 MiB
|
1 MiB
|
+91.7% |
| L3 Cache |
64 MiB
|
-- | |
| Memory Channels |
2
|
-- | |
| Maximum Memory |
128 GB
|
8 GB
|
+93.8% |
| Max Bandwidth |
48 GB/s
|
-- | |
| PCIe Lanes |
20
|
-- | |
| Max CPUs |
1
|
1
|
0% |
| TDP (lower is better) |
65 W
|
4 W
|
93.8% more |
| Process (lower is better) |
7 nm
|
45 nm
|
84.4% less |
| Specification | Ryzen 9 PRO 3900 | Atom 230 |
|---|---|---|
| Designer | AMD | Intel |
| Family | Ryzen | Atom |
| Series | 3000 | 200 |
| Model Number | PRO | 230 |
| Microarchitecture | Zen 2 | Bonnell |
| Core Name | Matisse | Diamondville |
| Core Family | -- | 6 |
| Core Model | -- | 112 |
| Socket | Socket | BGA-437 |
| Package | µOPGA-1331 | FCBGA-437 |
| Chipset | -- | Calistoga |
| Memory Type | DDR4-3200 | -- |
| ECC Support | No | -- |
| PCIe Revision | 4.0 | -- |
| PCIe Configuration | 1x16+x4, 2x8+x4, 1x8+2x4+x4 | -- |
| Market Segment | Desktop | Mobile |
| Release Price | -- | $29.00 |
| Locked Multiplier | No | Yes |
Designer
Family
Series
Model Number
Microarchitecture
Core Name
Core Family
Core Model
Socket
Package
Chipset
Memory Type
ECC Support
PCIe Revision
PCIe Configuration
Market Segment
Release Price
Locked Multiplier
Manufacturing process and die characteristics
| Specification | Ryzen 9 PRO 3900 | Atom 230 |
|---|---|---|
| Process | 7 nm | 45 nm |
| Die Area | -- | 25.964 mm² |
| Transistor Count | -- | 0.05 billion |
| Manufacturer | TSMC | Intel |
| Technology | CMOS | CMOS |
| Word Size | 64-bit | 64-bit |
| ISA | x86-64 (x86) | x86-64 (x86) |
Process
Die Area
Transistor Count
Manufacturer
Technology
Word Size
ISA
Supported instruction set extensions comparison
| Extension | Ryzen 9 PRO 3900 | Atom 230 |
|---|---|---|
| ABM | ||
| ADX | ||
| AES | ||
| AMD-V | ||
| AMD-Vi | ||
| AVX | ||
| AVX-512 | ||
| AVX2 | ||
| AVX512BW | ||
| AVX512CD | ||
| AVX512DQ | ||
| AVX512F | ||
| AVX512VL | ||
| BMI1 | ||
| BMI2 | ||
| Boost 2 | ||
| CLMUL | ||
| EIST | ||
| EMMX | ||
| EPT | ||
| F16C | ||
| FMA | ||
| FMA3 | ||
| FPU | ||
| Flex Memory | ||
| HT | ||
| IPT | ||
| MMX | ||
| MPX | ||
| NX | ||
| Protected | ||
| RdRand | ||
| Real | ||
| SHA | ||
| SIPP | ||
| SMEP | ||
| SMM | ||
| SMT | ||
| SSE | ||
| SSE2 | ||
| SSE3 | ||
| SSE4.1 | ||
| SSE4.2 | ||
| SSE4a | ||
| SSSE3 | ||
| SST | ||
| Secure Key | ||
| SenseMI | ||
| TBT 2.0 | ||
| TSME | ||
| TSX | ||
| TXT | ||
| VMD | ||
| VT-d | ||
| VT-x | ||
| XFR 2 | ||
| vPro | ||
| x86-16 | ||
| x86-32 | ||
| x86-64 |
Your experience on this site will be improved by allowing cookies.