Combined benchmark scores for both processors
Head-to-head processor comparison
Combined benchmark scores for both processors
Out of 2,060 results in the database
Rank #595
Rank #124
Ryzen AI 7 350 wins by 17.5% (Rank #595 vs #124)
Out of 2,060 results in the database
Rank #996
Rank #87
Ryzen AI 7 350 wins by 26.3% (Rank #996 vs #87)
Out of 2,060 results in the database
Rank #248
Rank #211
Ryzen AI 7 350 wins by 3.3% (Rank #248 vs #211)
Out of 1,771 results in the database
Rank #107
Rank #237
EPYC 7302 wins by 11.6% (Rank #107 vs #237)
Out of 1,771 results in the database
Rank #117
Rank #267
EPYC 7302 wins by 11.4% (Rank #117 vs #267)
Out of 1,771 results in the database
Rank #94
Rank #234
EPYC 7302 wins by 12.3% (Rank #94 vs #234)
Side-by-side comparison of key specifications
| Specification | EPYC 7302 | Ryzen AI 7 350 | Diff |
|---|---|---|---|
| Cores |
16
|
8
|
+50% |
| Threads |
32
|
16
|
+50% |
| Base Frequency |
3,000 MHz
|
2,000 MHz
|
+33.3% |
| Clock Multiplier |
28x
|
20x
|
+28.6% |
| L1 Cache |
1,024 KB
|
78 KB
|
+92.4% |
| L2 Cache |
8 MiB
|
1 MiB
|
+88.1% |
| L3 Cache |
128 MiB
|
-- | |
| Memory Channels |
8
|
-- | |
| Maximum Memory |
4,096 GB
|
-- | |
| Max Bandwidth |
191 GB/s
|
-- | |
| PCIe Lanes |
128
|
-- | |
| Max CPUs |
2
|
-- | |
| TDP (lower is better) |
155 W
|
28 W
|
81.9% more |
| Process (lower is better) |
7 nm
|
4 nm
|
42.9% more |
| Specification | EPYC 7302 | Ryzen AI 7 350 |
|---|---|---|
| Designer | AMD | AMD |
| Family | EPYC | -- |
| Series | 7002 | -- |
| Model Number | 7302 | -- |
| Microarchitecture | Zen 2 | -- |
| Core Name | Rome | Krackan Point |
| Core Family | 23 | -- |
| Socket | Socket SP3 and LGA-4094 | Socket FP8 |
| Package | FCLGA-4094 | FP8 |
| Memory Type | DDR4-3200 | DDR5, LPDDR5X |
| ECC Support | Yes | -- |
| PCIe Revision | 4.0 | -- |
| PCIe Configuration | x16, x8 | -- |
| Market Segment | Server | Mobile |
| Release Price | $978.00 | -- |
| Locked Multiplier | Yes | Yes |
Designer
Family
Series
Model Number
Microarchitecture
Core Name
Core Family
Socket
Package
Memory Type
ECC Support
PCIe Revision
PCIe Configuration
Market Segment
Release Price
Locked Multiplier
Manufacturing process and die characteristics
| Specification | EPYC 7302 | Ryzen AI 7 350 |
|---|---|---|
| Process | 7 nm | 4 nm |
| Die Area | 192 mm² | 195 mm² |
| Transistor Count | 15,200 | -- |
| Manufacturer | TSMC and GlobalFoundries | TSMC |
| Technology | CMOS | -- |
| Word Size | 64-bit | -- |
| ISA | x86-64 (x86) | -- |
Process
Die Area
Transistor Count
Manufacturer
Technology
Word Size
ISA
Supported instruction set extensions comparison
| Extension | EPYC 7302 | Ryzen AI 7 350 |
|---|---|---|
| ABM | ||
| ADX | ||
| AES | ||
| AMD-V | ||
| AMD-Vi | ||
| AVX | ||
| AVX-512 | ||
| AVX2 | ||
| AVX512BW | ||
| AVX512CD | ||
| AVX512DQ | ||
| AVX512F | ||
| AVX512VL | ||
| AVX512_VNNI | ||
| BMI1 | ||
| BMI2 | ||
| Boost 2 | ||
| CLMUL | ||
| DL Boost | ||
| EIST | ||
| EMMX | ||
| EPT | ||
| F16C | ||
| FMA3 | ||
| FPU | ||
| HT | ||
| KPT | ||
| MBE Ctrl | ||
| MMX | ||
| NM | ||
| NX | ||
| Node Ctrlr | ||
| PTT | ||
| Protected | ||
| RdRand | ||
| Real | ||
| Run Sure | ||
| SEV | ||
| SHA | ||
| SME | ||
| SMEP | ||
| SMM | ||
| SMT | ||
| SSE | ||
| SSE2 | ||
| SSE3 | ||
| SSE4.1 | ||
| SSE4.2 | ||
| SSE4a | ||
| SSSE3 | ||
| SST | ||
| SenseMI | ||
| TBT 2.0 | ||
| TSME | ||
| TSX | ||
| TXT | ||
| VMD | ||
| VT-d | ||
| VT-x | ||
| vPro | ||
| x86-16 | ||
| x86-32 | ||
| x86-64 |
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