Combined benchmark scores for both processors
Head-to-head processor comparison
Combined benchmark scores for both processors
Out of 2,060 results in the database
Rank #1,345
Rank #1,854
Core m3-6Y30 wins by 9.1% (Rank #1345 vs #1854)
Out of 2,060 results in the database
Rank #1,334
Rank #1,825
Core m3-6Y30 wins by 12.3% (Rank #1334 vs #1825)
Out of 2,060 results in the database
Rank #1,427
Rank #1,971
Core m3-6Y30 wins by 4.3% (Rank #1427 vs #1971)
Out of 1,771 results in the database
Rank #1,392
Number Crunching not available for both processors.
Out of 1,771 results in the database
Rank #1,426
Data Processing not available for both processors.
Out of 1,771 results in the database
Rank #1,214
Physics & Compute not available for both processors.
Side-by-side comparison of key specifications
| Specification | Core m3-6Y30 | Core 2 Duo T5850 | Diff |
|---|---|---|---|
| Cores |
2
|
2
|
0% |
| Threads |
4
|
4
|
0% |
| Base Frequency |
900 MHz
|
2,160 MHz
|
-58.3% |
| Turbo Frequency (1 core) |
2,200 MHz
|
-- | |
| Turbo Frequency (2 cores) |
2,000 MHz
|
-- | |
| Clock Multiplier |
9x
|
-- | |
| L1 Cache |
128 KB
|
-- | |
| L2 Cache |
1 MiB
|
-- | |
| L3 Cache |
4 MiB
|
-- | |
| Memory Channels |
2
|
2
|
0% |
| Maximum Memory |
16 GB
|
0 GB
|
+100% |
| Max Bandwidth |
28 GB/s
|
21 GB/s
|
+23.4% |
| PCIe Lanes | -- |
4
|
|
| Max CPUs |
1
|
1
|
0% |
| TDP (lower is better) |
5 W
|
35 W
|
87.1% less |
| Process (lower is better) |
14 nm
|
65 nm
|
78.5% less |
| Specification | Core m3-6Y30 | Core 2 Duo T5850 |
|---|---|---|
| Designer | Intel | Intel |
| Family | Core | -- |
| Series | m-6Y | -- |
| Model Number | m3-6Y30 | T3400 |
| Microarchitecture | Skylake | -- |
| Core Name | Skylake | -- |
| Core Family | 6 | -- |
| Core Model | 78 | -- |
| Socket | BGA 1515 | PPGA478 |
| Package | FCBGA-1515 | -- |
| Memory Type | LPDDR3-1866 and DDR3L-1600 | DDR3L 1066 |
| ECC Support | No | No |
| PCIe Revision | -- | 2.0 |
| PCIe Configuration | -- | 1x16, 2x8, 1x8 2x4 |
| Market Segment | Mobile | -- |
| Release Price | $281.00 | -- |
| Locked Multiplier | Yes | -- |
Designer
Family
Series
Model Number
Microarchitecture
Core Name
Core Family
Core Model
Socket
Package
Memory Type
ECC Support
PCIe Revision
PCIe Configuration
Market Segment
Release Price
Locked Multiplier
Manufacturing process and die characteristics
| Specification | Core m3-6Y30 | Core 2 Duo T5850 |
|---|---|---|
| Process | 14 nm | 65 nm |
| Die Area | 98.57 mm² | -- |
| Transistor Count | 1.75 billion | -- |
| Manufacturer | Intel | -- |
| Technology | CMOS | -- |
| Word Size | 64-bit | 64-bit |
| ISA | x86-64 (x86) | -- |
Process
Die Area
Transistor Count
Manufacturer
Technology
Word Size
ISA
Integrated GPU specifications comparison
| Specification | Core m3-6Y30 | Core 2 Duo T5850 |
|---|---|---|
| GPU | HD Graphics 515 | HD Graphics |
| GPU Designer | Intel | Intel |
| GPU Max Frequency | 850 MHz | 844 MHz |
| Execution Units | 24 | -- |
GPU
GPU Designer
GPU Max Frequency
Execution Units
Supported instruction set extensions comparison
| Extension | Core m3-6Y30 | Core 2 Duo T5850 |
|---|---|---|
| ABM | ||
| ADX | ||
| AES | ||
| ATT | ||
| AVX | ||
| AVX-512 | ||
| AVX2 | ||
| AVX512BW | ||
| AVX512CD | ||
| AVX512DQ | ||
| AVX512F | ||
| AVX512VL | ||
| AVX512_VNNI | ||
| BMI1 | ||
| BMI2 | ||
| CLMUL | ||
| DL Boost | ||
| EIST | ||
| EMMX | ||
| EPT | ||
| F16C | ||
| FMA | ||
| FMA3 | ||
| FPU | ||
| Flex Memory | ||
| HT | ||
| IPT | ||
| ISRT | ||
| KPT | ||
| MBE Ctrl | ||
| MMX | ||
| MPX | ||
| MWT | ||
| NM | ||
| NX | ||
| Node Ctrlr | ||
| PTT | ||
| Protected | ||
| RdRand | ||
| Real | ||
| Run Sure | ||
| SGX | ||
| SIPP | ||
| SMEP | ||
| SMM | ||
| SSE | ||
| SSE2 | ||
| SSE3 | ||
| SSE4.1 | ||
| SSE4.2 | ||
| SSSE3 | ||
| SST | ||
| Secure Key | ||
| TBT 2.0 | ||
| TSX | ||
| TXT | ||
| VMD | ||
| VT-d | ||
| VT-x | ||
| vPro | ||
| x86-16 | ||
| x86-32 | ||
| x86-64 |
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