Combined benchmark scores for both processors
Head-to-head processor comparison
Combined benchmark scores for both processors
Out of 2,060 results in the database
Rank #1,309
Rank #1,748
Core M 5Y71 wins by 7.4% (Rank #1309 vs #1748)
Out of 2,060 results in the database
Rank #1,225
Rank #1,701
Core M 5Y71 wins by 11.2% (Rank #1225 vs #1701)
Out of 2,060 results in the database
Rank #1,715
Rank #1,894
Core M 5Y71 wins by 1.4% (Rank #1715 vs #1894)
Out of 1,771 results in the database
Number Crunching not available for both processors.
Out of 1,771 results in the database
Data Processing not available for both processors.
Out of 1,771 results in the database
Physics & Compute not available for both processors.
Side-by-side comparison of key specifications
| Specification | Core M 5Y71 | Core 2 Duo T8100 | Diff |
|---|---|---|---|
| Cores |
2
|
2
|
0% |
| Threads |
4
|
4
|
0% |
| Base Frequency |
1,200 MHz
|
2,100 MHz
|
-42.9% |
| Turbo Frequency (1 core) |
2,900 MHz
|
-- | |
| Clock Multiplier |
12x
|
11x
|
+12.5% |
| L1 Cache | -- |
62 KB
|
|
| L2 Cache |
512 MiB
|
3 MiB
|
+99.4% |
| L3 Cache |
4 MiB
|
-- | |
| Memory Channels | -- |
2
|
|
| Maximum Memory |
16 GB
|
0 GB
|
+100% |
| Max Bandwidth | -- |
26 GB/s
|
|
| PCIe Lanes | -- |
2
|
|
| Max CPUs |
1
|
1
|
0% |
| TDP (lower is better) |
5 W
|
35 W
|
87.1% less |
| Process (lower is better) |
14 nm
|
45 nm
|
68.9% less |
| Specification | Core M 5Y71 | Core 2 Duo T8100 |
|---|---|---|
| Designer | Intel | Intel |
| Family | Core | -- |
| Series | 5000 | -- |
| Model Number | 5Y71 | T8100 |
| Microarchitecture | Broadwell | -- |
| Core Name | Broadwell | Penryn |
| Core Family | 06 | -- |
| Core Model | 3D | -- |
| Socket | -- | BGA479, PGA478 |
| Package | -- | µFC-PGA8 |
| Memory Type | -- | LPDDR3 1600 |
| ECC Support | -- | No |
| PCIe Revision | -- | 2.0 |
| PCIe Configuration | -- | 2x1, 1x2 |
| Market Segment | Mobile | Mobile |
| Locked Multiplier | Yes | Yes |
Designer
Family
Series
Model Number
Microarchitecture
Core Name
Core Family
Core Model
Socket
Package
Memory Type
ECC Support
PCIe Revision
PCIe Configuration
Market Segment
Locked Multiplier
Manufacturing process and die characteristics
| Specification | Core M 5Y71 | Core 2 Duo T8100 |
|---|---|---|
| Process | 14 nm | 45 nm |
| Die Area | 82 mm² | 81 mm² |
| Transistor Count | 1.30 billion | 0.00 billion |
| Manufacturer | Intel | Intel |
| Technology | CMOS | -- |
| Word Size | 64-bit | 64-bit |
| ISA | x86-64 (x86) | -- |
Process
Die Area
Transistor Count
Manufacturer
Technology
Word Size
ISA
Integrated GPU specifications comparison
| Specification | Core M 5Y71 | Core 2 Duo T8100 |
|---|---|---|
| GPU | Intel HD Graphics 5300 | HD Graphics |
| GPU Designer | -- | Intel |
| GPU Max Frequency | 900 MHz | 1000 MHz |
GPU
GPU Designer
GPU Max Frequency
Supported instruction set extensions comparison
| Extension | Core M 5Y71 | Core 2 Duo T8100 |
|---|---|---|
| AES | ||
| ATT | ||
| AVX | ||
| AVX2 | ||
| BMI1 | ||
| BMI2 | ||
| CLMUL | ||
| EIST | ||
| EMMX | ||
| EPT | ||
| F16C | ||
| FMA | ||
| FPU | ||
| Flex Memory | ||
| HT | ||
| IPT | ||
| MMX | ||
| MWT | ||
| NX | ||
| Protected | ||
| Real | ||
| SIPP | ||
| SMEP | ||
| SMM | ||
| SSE | ||
| SSE2 | ||
| SSE3 | ||
| SSE4.1 | ||
| SSE4.2 | ||
| SSSE3 | ||
| Secure Key | ||
| TBT 2.0 | ||
| TSX | ||
| TXT | ||
| VT-d | ||
| VT-x | ||
| vPro | ||
| x86-16 | ||
| x86-32 | ||
| x86-64 |
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