Combined benchmark scores for both processors
Head-to-head processor comparison
Combined benchmark scores for both processors
Out of 2,060 results in the database
Rank #254
Rank #1,787
Core i7-8670 wins by 31.3% (Rank #254 vs #1787)
Out of 2,060 results in the database
Rank #109
Rank #1,599
Core i7-8670 wins by 36.1% (Rank #109 vs #1599)
Out of 2,060 results in the database
Rank #529
Rank #2,056
Core i7-8670 wins by 22.3% (Rank #529 vs #2056)
Out of 1,771 results in the database
Number Crunching not available for both processors.
Out of 1,771 results in the database
Data Processing not available for both processors.
Out of 1,771 results in the database
Physics & Compute not available for both processors.
Side-by-side comparison of key specifications
| Specification | Core i7-8670 | Core 2 Duo T9500 | Diff |
|---|---|---|---|
| Cores |
6
|
2
|
+66.7% |
| Threads |
12
|
2
|
+83.3% |
| Base Frequency |
3,100 MHz
|
2,600 MHz
|
+16.1% |
| Clock Multiplier |
31x
|
13x
|
+58.1% |
| L1 Cache |
384 KB
|
62 KB
|
+83.7% |
| L2 Cache |
2 MiB
|
6 MiB
|
-73.8% |
| L3 Cache |
12 MiB
|
-- | |
| Memory Channels |
2
|
2
|
0% |
| Maximum Memory |
64 GB
|
0 GB
|
+100% |
| Max Bandwidth |
40 GB/s
|
26 GB/s
|
+35.6% |
| PCIe Lanes |
16
|
1
|
+93.8% |
| Max CPUs |
1
|
1
|
0% |
| TDP (lower is better) |
65 W
|
35 W
|
46.2% more |
| Process (lower is better) |
14 nm
|
45 nm
|
68.9% less |
| Specification | Core i7-8670 | Core 2 Duo T9500 |
|---|---|---|
| Designer | Intel | Intel |
| Family | Core | -- |
| Series | i7-8000 | -- |
| Model Number | i7-8670 | T9500 |
| Microarchitecture | Coffee Lake | -- |
| Core Name | Coffee Lake S | Penryn |
| Socket | LGA-1151 | BGA479, PGA478, PPGA478 |
| Package | FCLGA-1151 | µFC-PGA8 |
| Memory Type | DDR4-2666 | DDR3/L/-RS 1333/1600 |
| ECC Support | No | No |
| PCIe Revision | 3.0 | 2.0 |
| PCIe Configuration | 1x16, 2x8, 1x8+2x4 | 1x16, 2x8, 1x8 2x4 |
| Market Segment | Desktop | Mobile |
| Locked Multiplier | Yes | Yes |
Designer
Family
Series
Model Number
Microarchitecture
Core Name
Socket
Package
Memory Type
ECC Support
PCIe Revision
PCIe Configuration
Market Segment
Locked Multiplier
Manufacturing process and die characteristics
| Specification | Core i7-8670 | Core 2 Duo T9500 |
|---|---|---|
| Process | 14 nm | 45 nm |
| Die Area | 149 mm² | 107 mm² |
| Transistor Count | -- | 0.00 billion |
| Manufacturer | Intel | Intel |
| Technology | CMOS | -- |
| Word Size | 64-bit | 64-bit |
| ISA | x86-64 (x86) | -- |
Process
Die Area
Transistor Count
Manufacturer
Technology
Word Size
ISA
Integrated GPU specifications comparison
| Specification | Core i7-8670 | Core 2 Duo T9500 |
|---|---|---|
| GPU | UHD Graphics 630 | HD Graphics |
| GPU Designer | Intel | Intel |
| GPU Max Frequency | 1200 MHz | 1000 MHz |
| Execution Units | 24 | -- |
GPU
GPU Designer
GPU Max Frequency
Execution Units
Supported instruction set extensions comparison
| Extension | Core i7-8670 | Core 2 Duo T9500 |
|---|---|---|
| ABM | ||
| ADX | ||
| AES | ||
| AVX | ||
| AVX2 | ||
| BMI1 | ||
| BMI2 | ||
| CLMUL | ||
| EIST | ||
| EMMX | ||
| EPT | ||
| F16C | ||
| FMA | ||
| FMA3 | ||
| FPU | ||
| Flex Memory | ||
| HT | ||
| IPT | ||
| MMX | ||
| MPX | ||
| NX | ||
| Protected | ||
| RdRand | ||
| Real | ||
| SGX | ||
| SIPP | ||
| SMEP | ||
| SMM | ||
| SSE | ||
| SSE2 | ||
| SSE3 | ||
| SSE4.1 | ||
| SSE4.2 | ||
| SSSE3 | ||
| Secure Key | ||
| TBT 2.0 | ||
| TSX | ||
| TXT | ||
| VT-d | ||
| VT-x | ||
| vPro | ||
| x86-16 | ||
| x86-32 | ||
| x86-64 |
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