Combined benchmark scores for both processors
Head-to-head processor comparison
Combined benchmark scores for both processors
Out of 2,060 results in the database
Rank #254
Rank #1,720
Core i7-8670 wins by 30.4% (Rank #254 vs #1720)
Out of 2,060 results in the database
Rank #109
Rank #1,733
Core i7-8670 wins by 38.2% (Rank #109 vs #1733)
Out of 2,060 results in the database
Rank #529
Rank #1,565
Core i7-8670 wins by 15.7% (Rank #529 vs #1565)
Out of 1,771 results in the database
Number Crunching not available for both processors.
Out of 1,771 results in the database
Data Processing not available for both processors.
Out of 1,771 results in the database
Physics & Compute not available for both processors.
Side-by-side comparison of key specifications
| Specification | Core i7-8670 | Phenom II N850 | Diff |
|---|---|---|---|
| Cores |
6
|
2
|
+66.7% |
| Threads |
12
|
4
|
+66.7% |
| Base Frequency |
3,100 MHz
|
1,600 MHz
|
+48.4% |
| Clock Multiplier |
31x
|
-- | |
| L1 Cache |
384 KB
|
-- | |
| L2 Cache |
2 MiB
|
-- | |
| L3 Cache |
12 MiB
|
-- | |
| Memory Channels |
2
|
2
|
0% |
| Maximum Memory |
64 GB
|
0 GB
|
+100% |
| Max Bandwidth |
40 GB/s
|
26 GB/s
|
+35.6% |
| PCIe Lanes |
16
|
12
|
+25% |
| Max CPUs |
1
|
1
|
0% |
| TDP (lower is better) |
65 W
|
12 W
|
82.3% more |
| Process (lower is better) |
14 nm
|
22 nm
|
36.4% less |
| Specification | Core i7-8670 | Phenom II N850 |
|---|---|---|
| Designer | Intel | AMD |
| Family | Core | -- |
| Series | i7-8000 | -- |
| Model Number | i7-8670 | i5-4202Y |
| Microarchitecture | Coffee Lake | -- |
| Core Name | Coffee Lake S | -- |
| Socket | LGA-1151 | FCBGA1168 |
| Package | FCLGA-1151 | -- |
| Memory Type | DDR4-2666 | DDR3L 1333/1600, LPDDR3 1333/1600 |
| ECC Support | No | No |
| PCIe Revision | 3.0 | 2.0 |
| PCIe Configuration | 1x16, 2x8, 1x8+2x4 | 4x1, 2x4 |
| Market Segment | Desktop | -- |
| Locked Multiplier | Yes | -- |
Designer
Family
Series
Model Number
Microarchitecture
Core Name
Socket
Package
Memory Type
ECC Support
PCIe Revision
PCIe Configuration
Market Segment
Locked Multiplier
Manufacturing process and die characteristics
| Specification | Core i7-8670 | Phenom II N850 |
|---|---|---|
| Process | 14 nm | 22 nm |
| Die Area | 149 mm² | -- |
| Manufacturer | Intel | -- |
| Technology | CMOS | -- |
| Word Size | 64-bit | 64-bit |
| ISA | x86-64 (x86) | -- |
Process
Die Area
Manufacturer
Technology
Word Size
ISA
Integrated GPU specifications comparison
| Specification | Core i7-8670 | Phenom II N850 |
|---|---|---|
| GPU | UHD Graphics 630 | HD graphics 4200 |
| GPU Designer | Intel | Intel |
| GPU Max Frequency | 1200 MHz | 850 MHz |
| Execution Units | 24 | -- |
GPU
GPU Designer
GPU Max Frequency
Execution Units
Supported instruction set extensions comparison
| Extension | Core i7-8670 | Phenom II N850 |
|---|---|---|
| ABM | ||
| ADX | ||
| AES | ||
| AVX | ||
| AVX2 | ||
| BMI1 | ||
| BMI2 | ||
| CLMUL | ||
| EIST | ||
| EMMX | ||
| EPT | ||
| F16C | ||
| FMA | ||
| FMA3 | ||
| FPU | ||
| Flex Memory | ||
| HT | ||
| IPT | ||
| MMX | ||
| MPX | ||
| NX | ||
| Protected | ||
| RdRand | ||
| Real | ||
| SGX | ||
| SIPP | ||
| SMEP | ||
| SMM | ||
| SSE | ||
| SSE2 | ||
| SSE3 | ||
| SSE4.1 | ||
| SSE4.2 | ||
| SSSE3 | ||
| Secure Key | ||
| TBT 2.0 | ||
| TSX | ||
| TXT | ||
| VT-d | ||
| VT-x | ||
| vPro | ||
| x86-16 | ||
| x86-32 | ||
| x86-64 |
Your experience on this site will be improved by allowing cookies.