Intel Core i5-670 vs AMD Sempron 3200+

Head-to-head processor comparison

Aggregated Scores

Combined benchmark scores for both processors


Overall Score

Out of 2,060 results in the database

4,452

Rank #1,332

vs
3,750

Rank #2,032

4,452
3,750

Core i5-670 wins by 15.8% (Rank #1332 vs #2032)

Singlecore Score

Out of 2,060 results in the database

4,486

Rank #1,300

vs
3,424

Rank #2,031

4,486
3,424

Core i5-670 wins by 23.7% (Rank #1300 vs #2031)

Multicore Score

Out of 2,060 results in the database

4,401

Rank #1,448

vs
4,240

Rank #1,934

4,401
4,240

Core i5-670 wins by 3.7% (Rank #1448 vs #1934)

Number Crunching

Out of 1,771 results in the database

4,534

Rank #1,264

vs
4,457

Rank #1,754

4,534
4,457

Core i5-670 wins by 1.7% (Rank #1264 vs #1754)

Data Processing

Out of 1,771 results in the database

4,521

Rank #1,205

vs
4,418

Rank #1,762

4,521
4,418

Core i5-670 wins by 2.3% (Rank #1205 vs #1762)

Physics & Compute

Out of 1,771 results in the database

4,514

Rank #1,306

vs
4,430

Rank #1,767

4,514
4,430

Core i5-670 wins by 1.9% (Rank #1306 vs #1767)


Specifications

Side-by-side comparison of key specifications


Specification Core i5-670 Sempron 3200+ Diff
Cores
2
1
+50%
Threads
4
1
+75%
Base Frequency
3,466 MHz
1,800 MHz
+48.1%
Clock Multiplier
26x
9x
+65.4%
L1 Cache
62 KB
--
L2 Cache
0 MiB
--
L3 Cache
4 MiB
--
TDP (lower is better)
73 W
62 W
15.1% more
Process (lower is better)
32 nm
90 nm
64.4% less

General Information

Specification Core i5-670 Sempron 3200+
Designer Intel AMD
Core Name Clarkdale Manila
Socket Socket 1156 Socket AM2
Package FC-LGA10 µPGA
Memory Type DDR3 DDR1
Market Segment Desktop Desktop
Locked Multiplier Yes Yes

Designer

Core i5-670
Intel
Sempron 3200+
AMD

Core Name

Core i5-670
Clarkdale
Sempron 3200+
Manila

Socket

Core i5-670
Socket 1156
Sempron 3200+
Socket AM2

Package

Core i5-670
FC-LGA10
Sempron 3200+
µPGA

Memory Type

Core i5-670
DDR3
Sempron 3200+
DDR1

Market Segment

Core i5-670
Desktop
Sempron 3200+
Desktop

Locked Multiplier

Core i5-670
Yes
Sempron 3200+
Yes

Physical Specifications

Manufacturing process and die characteristics


Specification Core i5-670 Sempron 3200+
Process 32 nm 90 nm
Die Area 81 mm² 103 mm²
Transistor Count 0.00 billion 0.00 billion
Manufacturer Intel --

Process

Core i5-670
32 nm
Sempron 3200+
90 nm

Die Area

Core i5-670
81 mm²
Sempron 3200+
103 mm²

Transistor Count

Core i5-670
0.00 billion
Sempron 3200+
0.00 billion

Manufacturer

Core i5-670
Intel
Sempron 3200+
--

CPU Extensions

Supported instruction set extensions comparison


Extension Core i5-670 Sempron 3200+
3DNow!
MMX
SSE
SSE2
SSE3
SSE4.1
SSE4.2
SSSE3
TXT
VT-d
VT-x