Combined benchmark scores for both processors
Head-to-head processor comparison
Combined benchmark scores for both processors
Out of 2,060 results in the database
Rank #301
Rank #1,235
Ryzen 7 PRO 2700X wins by 22.3% (Rank #301 vs #1235)
Out of 2,060 results in the database
Rank #346
Rank #1,232
Ryzen 7 PRO 2700X wins by 21.5% (Rank #346 vs #1232)
Out of 2,060 results in the database
Rank #255
Rank #1,202
Ryzen 7 PRO 2700X wins by 23.6% (Rank #255 vs #1202)
Out of 1,771 results in the database
Rank #406
Rank #923
Ryzen 7 PRO 2700X wins by 6.9% (Rank #406 vs #923)
Out of 1,771 results in the database
Rank #284
Rank #931
Ryzen 7 PRO 2700X wins by 13.1% (Rank #284 vs #931)
Out of 1,771 results in the database
Rank #498
Rank #997
Ryzen 7 PRO 2700X wins by 5.9% (Rank #498 vs #997)
Side-by-side comparison of key specifications
| Specification | Ryzen 7 PRO 2700X | Xeon W5590 | Diff |
|---|---|---|---|
| Cores |
8
|
4
|
+50% |
| Threads |
16
|
8
|
+50% |
| Base Frequency |
3,600 MHz
|
3,333 MHz
|
+7.4% |
| Clock Multiplier |
36x
|
25x
|
+30.6% |
| L1 Cache |
768 KB
|
62 KB
|
+91.9% |
| L2 Cache |
4 MiB
|
0 MiB
|
+93.9% |
| L3 Cache |
16 MiB
|
8 MiB
|
+52.3% |
| Memory Channels |
2
|
-- | |
| Maximum Memory |
64 GB
|
-- | |
| Max Bandwidth |
44 GB/s
|
-- | |
| Max CPUs |
1
|
-- | |
| TDP (lower is better) |
105 W
|
130 W
|
19.2% less |
| Process (lower is better) |
12 nm
|
45 nm
|
73.3% less |
| Specification | Ryzen 7 PRO 2700X | Xeon W5590 |
|---|---|---|
| Designer | AMD | Intel |
| Family | Ryzen | -- |
| Series | 2000 | -- |
| Model Number | PRO | -- |
| Microarchitecture | Zen+ | -- |
| Core Name | Pinnacle | Gainestown |
| Core Family | 23 | -- |
| Core Model | 8 | -- |
| Socket | Socket | Socket 1366 |
| Package | µOPGA-1331 | FC-LGA8 |
| Chipset | Promontory | -- |
| Memory Type | DDR4-2933 | DDR3 |
| ECC Support | Yes | -- |
| Market Segment | Desktop | Server |
| Locked Multiplier | No | Yes |
Designer
Family
Series
Model Number
Microarchitecture
Core Name
Core Family
Core Model
Socket
Package
Chipset
Memory Type
ECC Support
Market Segment
Locked Multiplier
Manufacturing process and die characteristics
| Specification | Ryzen 7 PRO 2700X | Xeon W5590 |
|---|---|---|
| Process | 12 nm | 45 nm |
| Die Area | 213 mm² | 263 mm² |
| Transistor Count | 4.80 billion | 0.00 billion |
| Manufacturer | GlobalFoundries | Intel |
| Technology | CMOS | -- |
| Word Size | 64-bit | -- |
| ISA | x86-64 (x86) | -- |
Process
Die Area
Transistor Count
Manufacturer
Technology
Word Size
ISA
Supported instruction set extensions comparison
| Extension | Ryzen 7 PRO 2700X | Xeon W5590 |
|---|---|---|
| ABM | ||
| ADX | ||
| AES | ||
| AMD-V | ||
| AMD-Vi | ||
| AVX | ||
| AVX2 | ||
| BMI1 | ||
| BMI2 | ||
| Boost 2 | ||
| CLMUL | ||
| EIST | ||
| EMMX | ||
| EPT | ||
| F16C | ||
| FMA3 | ||
| FPU | ||
| MMX | ||
| NX | ||
| Protected | ||
| RdRand | ||
| Real | ||
| SHA | ||
| SMEP | ||
| SMM | ||
| SMT | ||
| SSE | ||
| SSE2 | ||
| SSE3 | ||
| SSE4.1 | ||
| SSE4.2 | ||
| SSE4a | ||
| SSSE3 | ||
| SenseMI | ||
| TBT 1.0 | ||
| TSME | ||
| TXT | ||
| VT-d | ||
| VT-x | ||
| XFR 2 | ||
| x86-16 | ||
| x86-32 | ||
| x86-64 |
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