Combined benchmark scores for both processors
Head-to-head processor comparison
Combined benchmark scores for both processors
Out of 2,060 results in the database
Rank #381
Rank #1,369
Ryzen 7 PRO 2700 wins by 22% (Rank #381 vs #1369)
Out of 2,060 results in the database
Rank #483
Rank #1,383
Ryzen 7 PRO 2700 wins by 21.3% (Rank #483 vs #1383)
Out of 2,060 results in the database
Rank #296
Rank #1,337
Ryzen 7 PRO 2700 wins by 22.9% (Rank #296 vs #1337)
Out of 1,771 results in the database
Rank #440
Rank #998
Ryzen 7 PRO 2700 wins by 6.5% (Rank #440 vs #998)
Out of 1,771 results in the database
Rank #332
Rank #1,030
Ryzen 7 PRO 2700 wins by 12% (Rank #332 vs #1030)
Out of 1,771 results in the database
Rank #533
Rank #1,057
Ryzen 7 PRO 2700 wins by 5.5% (Rank #533 vs #1057)
Side-by-side comparison of key specifications
| Specification | Ryzen 7 PRO 2700 | Xeon E5540 | Diff |
|---|---|---|---|
| Cores |
8
|
4
|
+50% |
| Threads |
16
|
8
|
+50% |
| Base Frequency |
3,200 MHz
|
2,530 MHz
|
+20.9% |
| Clock Multiplier |
32x
|
19x
|
+40.6% |
| L1 Cache |
768 KB
|
62 KB
|
+91.9% |
| L2 Cache |
4 MiB
|
0 MiB
|
+93.9% |
| L3 Cache |
16 MiB
|
8 MiB
|
+52.3% |
| Memory Channels |
2
|
3
|
-33.3% |
| Maximum Memory |
64 GB
|
0 GB
|
+99.8% |
| Max Bandwidth |
44 GB/s
|
26 GB/s
|
+41.4% |
| PCIe Lanes | -- |
16
|
|
| Max CPUs |
1
|
2
|
-50% |
| TDP (lower is better) |
65 W
|
80 W
|
18.8% less |
| Process (lower is better) |
12 nm
|
45 nm
|
73.3% less |
| Specification | Ryzen 7 PRO 2700 | Xeon E5540 |
|---|---|---|
| Designer | AMD | Intel |
| Family | Ryzen | -- |
| Series | 2000 | -- |
| Model Number | PRO | E5540 |
| Microarchitecture | Zen+ | -- |
| Core Name | Pinnacle | Gainestown |
| Core Family | 23 | -- |
| Core Model | 8 | -- |
| Socket | Socket | FCLGA1366 |
| Package | µOPGA-1331 | FC-LGA8 |
| Chipset | Promontory | -- |
| Memory Type | DDR4-2933 | DDR3 800/1066 |
| ECC Support | Yes | Yes |
| PCIe Revision | -- | Up to 3.0 |
| PCIe Configuration | -- | Up to 1x16, 2x8, 1x8+2x4 |
| Market Segment | Desktop | Server |
| Locked Multiplier | No | Yes |
Designer
Family
Series
Model Number
Microarchitecture
Core Name
Core Family
Core Model
Socket
Package
Chipset
Memory Type
ECC Support
PCIe Revision
PCIe Configuration
Market Segment
Locked Multiplier
Manufacturing process and die characteristics
| Specification | Ryzen 7 PRO 2700 | Xeon E5540 |
|---|---|---|
| Process | 12 nm | 45 nm |
| Die Area | 213 mm² | 263 mm² |
| Transistor Count | 4.80 billion | 0.00 billion |
| Manufacturer | GlobalFoundries | Intel |
| Technology | CMOS | -- |
| Word Size | 64-bit | 64-bit |
| ISA | x86-64 (x86) | -- |
Process
Die Area
Transistor Count
Manufacturer
Technology
Word Size
ISA
Integrated GPU specifications comparison
| Specification | Ryzen 7 PRO 2700 | Xeon E5540 |
|---|---|---|
| GPU | -- | HD Graphics |
| GPU Designer | -- | Intel |
| GPU Max Frequency | -- | 1100 MHz |
GPU
GPU Designer
GPU Max Frequency
Supported instruction set extensions comparison
| Extension | Ryzen 7 PRO 2700 | Xeon E5540 |
|---|---|---|
| ABM | ||
| ADX | ||
| AES | ||
| AMD-V | ||
| AMD-Vi | ||
| AVX | ||
| AVX2 | ||
| BMI1 | ||
| BMI2 | ||
| Boost 2 | ||
| CLMUL | ||
| EIST | ||
| EMMX | ||
| EPT | ||
| F16C | ||
| FMA | ||
| FMA3 | ||
| FPU | ||
| Flex Memory | ||
| HT | ||
| IPT | ||
| MMX | ||
| NX | ||
| Protected | ||
| RdRand | ||
| Real | ||
| SHA | ||
| SIPP | ||
| SMEP | ||
| SMM | ||
| SMT | ||
| SSE | ||
| SSE2 | ||
| SSE3 | ||
| SSE4.1 | ||
| SSE4.2 | ||
| SSE4a | ||
| SSSE3 | ||
| Secure Key | ||
| SenseMI | ||
| TBT 1.0 | ||
| TSME | ||
| TSX | ||
| TXT | ||
| VT-d | ||
| VT-x | ||
| XFR 2 | ||
| vPro | ||
| x86-16 | ||
| x86-32 | ||
| x86-64 |
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