Combined benchmark scores for both processors
Head-to-head processor comparison
Combined benchmark scores for both processors
Out of 2,060 results in the database
Rank #381
Rank #1,772
Ryzen 7 PRO 2700 wins by 27.1% (Rank #381 vs #1772)
Out of 2,060 results in the database
Rank #483
Rank #1,687
Ryzen 7 PRO 2700 wins by 27% (Rank #483 vs #1687)
Out of 2,060 results in the database
Rank #296
Rank #2,018
Ryzen 7 PRO 2700 wins by 27.3% (Rank #296 vs #2018)
Out of 1,771 results in the database
Rank #440
Number Crunching not available for both processors.
Out of 1,771 results in the database
Rank #332
Data Processing not available for both processors.
Out of 1,771 results in the database
Rank #533
Physics & Compute not available for both processors.
Side-by-side comparison of key specifications
| Specification | Ryzen 7 PRO 2700 | Core 2 Duo E8400 | Diff |
|---|---|---|---|
| Cores |
8
|
2
|
+75% |
| Threads |
16
|
4
|
+75% |
| Base Frequency |
3,200 MHz
|
3,000 MHz
|
+6.3% |
| Clock Multiplier |
32x
|
9x
|
+71.9% |
| L1 Cache |
768 KB
|
62 KB
|
+91.9% |
| L2 Cache |
4 MiB
|
6 MiB
|
-30.1% |
| L3 Cache |
16 MiB
|
-- | |
| Memory Channels |
2
|
2
|
0% |
| Maximum Memory |
64 GB
|
0 GB
|
+100% |
| Max Bandwidth |
44 GB/s
|
26 GB/s
|
+41.4% |
| PCIe Lanes | -- |
12
|
|
| Max CPUs |
1
|
1
|
0% |
| TDP (lower is better) |
65 W
|
65 W
|
0% |
| Process (lower is better) |
12 nm
|
45 nm
|
73.3% less |
| Specification | Ryzen 7 PRO 2700 | Core 2 Duo E8400 |
|---|---|---|
| Designer | AMD | Intel |
| Family | Ryzen | -- |
| Series | 2000 | -- |
| Model Number | PRO | E8400 |
| Microarchitecture | Zen+ | -- |
| Core Name | Pinnacle | Wolfdale |
| Core Family | 23 | -- |
| Core Model | 8 | -- |
| Socket | Socket | LGA775 |
| Package | µOPGA-1331 | FC-LGA6 |
| Chipset | Promontory | -- |
| Memory Type | DDR4-2933 | DDR3L 1333/1600, LPDDR3 1333/1600 |
| ECC Support | Yes | No |
| PCIe Revision | -- | 2.0 |
| PCIe Configuration | -- | 4x1, 2x4 |
| Market Segment | Desktop | Desktop |
| Locked Multiplier | No | Yes |
Designer
Family
Series
Model Number
Microarchitecture
Core Name
Core Family
Core Model
Socket
Package
Chipset
Memory Type
ECC Support
PCIe Revision
PCIe Configuration
Market Segment
Locked Multiplier
Manufacturing process and die characteristics
| Specification | Ryzen 7 PRO 2700 | Core 2 Duo E8400 |
|---|---|---|
| Process | 12 nm | 45 nm |
| Die Area | 213 mm² | 104 mm² |
| Transistor Count | 4.80 billion | 0.00 billion |
| Manufacturer | GlobalFoundries | Intel |
| Technology | CMOS | -- |
| Word Size | 64-bit | 64-bit |
| ISA | x86-64 (x86) | -- |
Process
Die Area
Transistor Count
Manufacturer
Technology
Word Size
ISA
Integrated GPU specifications comparison
| Specification | Ryzen 7 PRO 2700 | Core 2 Duo E8400 |
|---|---|---|
| GPU | -- | HD graphics 4200 |
| GPU Designer | -- | Intel |
| GPU Max Frequency | -- | 850 MHz |
GPU
GPU Designer
GPU Max Frequency
Supported instruction set extensions comparison
| Extension | Ryzen 7 PRO 2700 | Core 2 Duo E8400 |
|---|---|---|
| ABM | ||
| ADX | ||
| AES | ||
| AMD-V | ||
| AMD-Vi | ||
| AVX | ||
| AVX2 | ||
| BMI1 | ||
| BMI2 | ||
| Boost 2 | ||
| CLMUL | ||
| EIST | ||
| EMMX | ||
| EPT | ||
| F16C | ||
| FMA | ||
| FMA3 | ||
| FPU | ||
| Flex Memory | ||
| HT | ||
| IPT | ||
| MMX | ||
| NX | ||
| Protected | ||
| RdRand | ||
| Real | ||
| SHA | ||
| SIPP | ||
| SMEP | ||
| SMM | ||
| SMT | ||
| SSE | ||
| SSE2 | ||
| SSE3 | ||
| SSE4.1 | ||
| SSE4.2 | ||
| SSE4a | ||
| SSSE3 | ||
| Secure Key | ||
| SenseMI | ||
| TSME | ||
| TSX | ||
| TXT | ||
| VT-d | ||
| VT-x | ||
| XFR 2 | ||
| vPro | ||
| x86-16 | ||
| x86-32 | ||
| x86-64 |
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