Combined benchmark scores for both processors
Head-to-head processor comparison
Combined benchmark scores for both processors
Out of 2,060 results in the database
Rank #292
Rank #182
Xeon W-1370 wins by 5.3% (Rank #292 vs #182)
Out of 2,060 results in the database
Rank #298
Rank #121
Xeon W-1370 wins by 8.5% (Rank #298 vs #121)
Out of 2,060 results in the database
Rank #291
Rank #290
Xeon W-1370 wins by 0% (Rank #291 vs #290)
Out of 1,771 results in the database
Rank #461
Rank #266
Xeon W-1370 wins by 6.5% (Rank #461 vs #266)
Out of 1,771 results in the database
Rank #362
Rank #269
Xeon W-1370 wins by 3.9% (Rank #362 vs #269)
Out of 1,771 results in the database
Rank #506
Rank #311
Xeon W-1370 wins by 5.6% (Rank #506 vs #311)
Side-by-side comparison of key specifications
| Specification | Ryzen 7 2700E | Xeon W-1370 | Diff |
|---|---|---|---|
| Cores |
8
|
8
|
0% |
| Threads |
16
|
16
|
0% |
| Base Frequency |
2,800 MHz
|
2,900 MHz
|
-3.4% |
| Clock Multiplier |
28x
|
29x
|
-3.4% |
| L1 Cache |
768 KB
|
78 KB
|
+89.9% |
| L2 Cache |
4 MiB
|
0 MiB
|
+87.8% |
| L3 Cache |
16 MiB
|
15 MiB
|
+4.6% |
| Memory Channels |
2
|
-- | |
| Maximum Memory |
64 GB
|
-- | |
| Max Bandwidth |
44 GB/s
|
-- | |
| Max CPUs |
1
|
-- | |
| TDP (lower is better) |
45 W
|
80 W
|
43.8% less |
| Process (lower is better) |
12 nm
|
14 nm
|
14.3% less |
| Specification | Ryzen 7 2700E | Xeon W-1370 |
|---|---|---|
| Designer | AMD | Intel |
| Family | Ryzen | -- |
| Series | 2000 | -- |
| Model Number | 2700E | -- |
| Microarchitecture | Zen+ | -- |
| Core Name | Pinnacle | Rocket Lake-S |
| Core Family | 23 | -- |
| Core Model | 8 | -- |
| Socket | Socket | Socket 1200 |
| Package | µOPGA-1331 | FC-LGA1200 |
| Chipset | Promontory | -- |
| Memory Type | DDR4-2933 | DDR4 |
| ECC Support | Yes | -- |
| Market Segment | Desktop | Server/Workstation |
| Locked Multiplier | No | Yes |
Designer
Family
Series
Model Number
Microarchitecture
Core Name
Core Family
Core Model
Socket
Package
Chipset
Memory Type
ECC Support
Market Segment
Locked Multiplier
Manufacturing process and die characteristics
| Specification | Ryzen 7 2700E | Xeon W-1370 |
|---|---|---|
| Process | 12 nm | 14 nm |
| Die Area | 213 mm² | 276 mm² |
| Transistor Count | 4.80 billion | -- |
| Manufacturer | GlobalFoundries | Intel |
| Technology | CMOS | -- |
| Word Size | 64-bit | -- |
| ISA | x86-64 (x86) | -- |
Process
Die Area
Transistor Count
Manufacturer
Technology
Word Size
ISA
Supported instruction set extensions comparison
| Extension | Ryzen 7 2700E | Xeon W-1370 |
|---|---|---|
| ABM | ||
| ADX | ||
| AES | ||
| AMD-V | ||
| AMD-Vi | ||
| AVX | ||
| AVX2 | ||
| BMI1 | ||
| BMI2 | ||
| Boost 2 | ||
| CLMUL | ||
| EIST | ||
| EMMX | ||
| F16C | ||
| FMA3 | ||
| FPU | ||
| MMX | ||
| MPX | ||
| NX | ||
| Protected | ||
| RdRand | ||
| Real | ||
| SHA | ||
| SMEP | ||
| SMM | ||
| SMT | ||
| SSE | ||
| SSE2 | ||
| SSE3 | ||
| SSE4.1 | ||
| SSE4.2 | ||
| SSE4a | ||
| SSSE3 | ||
| SenseMI | ||
| TBT 2.0 | ||
| TSX | ||
| TXT | ||
| VT-d | ||
| VT-x | ||
| XFR 2 | ||
| vPro | ||
| x86-16 | ||
| x86-32 | ||
| x86-64 |
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