Combined benchmark scores for both processors
Head-to-head processor comparison
Combined benchmark scores for both processors
Out of 2,060 results in the database
Rank #292
Rank #1,516
Ryzen 7 2700E wins by 26.6% (Rank #292 vs #1516)
Out of 2,060 results in the database
Rank #298
Rank #1,478
Ryzen 7 2700E wins by 27.3% (Rank #298 vs #1478)
Out of 2,060 results in the database
Rank #291
Rank #1,729
Ryzen 7 2700E wins by 25.5% (Rank #291 vs #1729)
Out of 1,771 results in the database
Rank #461
Rank #1,464
Ryzen 7 2700E wins by 7.7% (Rank #461 vs #1464)
Out of 1,771 results in the database
Rank #362
Rank #1,543
Ryzen 7 2700E wins by 12.7% (Rank #362 vs #1543)
Out of 1,771 results in the database
Rank #506
Rank #1,560
Ryzen 7 2700E wins by 7.9% (Rank #506 vs #1560)
Side-by-side comparison of key specifications
| Specification | Ryzen 7 2700E | A6-5400B | Diff |
|---|---|---|---|
| Cores |
8
|
4
|
+50% |
| Threads |
16
|
4
|
+75% |
| Base Frequency |
2,800 MHz
|
3,600 MHz
|
-22.2% |
| Clock Multiplier |
28x
|
36x
|
-22.2% |
| L1 Cache |
768 KB
|
125 KB
|
+83.7% |
| L2 Cache |
4 MiB
|
1 MiB
|
+76.2% |
| L3 Cache |
16 MiB
|
-- | |
| Memory Channels |
2
|
-- | |
| Maximum Memory |
64 GB
|
-- | |
| Max Bandwidth |
44 GB/s
|
-- | |
| Max CPUs |
1
|
-- | |
| TDP (lower is better) |
45 W
|
65 W
|
30.8% less |
| Process (lower is better) |
12 nm
|
32 nm
|
62.5% less |
| Specification | Ryzen 7 2700E | A6-5400B |
|---|---|---|
| Designer | AMD | AMD |
| Family | Ryzen | -- |
| Series | 2000 | -- |
| Model Number | 2700E | -- |
| Microarchitecture | Zen+ | -- |
| Core Name | Pinnacle | Trinity |
| Core Family | 23 | -- |
| Core Model | 8 | -- |
| Socket | Socket | Socket FM2 |
| Package | µOPGA-1331 | µPGA |
| Chipset | Promontory | -- |
| Memory Type | DDR4-2933 | DDR3 |
| ECC Support | Yes | -- |
| Market Segment | Desktop | Desktop |
| Locked Multiplier | No | Yes |
Designer
Family
Series
Model Number
Microarchitecture
Core Name
Core Family
Core Model
Socket
Package
Chipset
Memory Type
ECC Support
Market Segment
Locked Multiplier
Manufacturing process and die characteristics
| Specification | Ryzen 7 2700E | A6-5400B |
|---|---|---|
| Process | 12 nm | 32 nm |
| Die Area | 213 mm² | 246 mm² |
| Transistor Count | 4.80 billion | 1,303 |
| Manufacturer | GlobalFoundries | GlobalFoundries |
| Technology | CMOS | -- |
| Word Size | 64-bit | -- |
| ISA | x86-64 (x86) | -- |
Process
Die Area
Transistor Count
Manufacturer
Technology
Word Size
ISA
Supported instruction set extensions comparison
| Extension | Ryzen 7 2700E | A6-5400B |
|---|---|---|
| 3DNow! | ||
| ABM | ||
| ADX | ||
| AES | ||
| AMD-V | ||
| AMD-Vi | ||
| AVX | ||
| AVX2 | ||
| BMI1 | ||
| BMI2 | ||
| Boost 2 | ||
| CLMUL | ||
| EMMX | ||
| F16C | ||
| FMA3 | ||
| FMA4 | ||
| FPU | ||
| MMX | ||
| NX | ||
| Protected | ||
| RdRand | ||
| Real | ||
| SHA | ||
| SMEP | ||
| SMM | ||
| SMT | ||
| SSE | ||
| SSE2 | ||
| SSE3 | ||
| SSE4.1 | ||
| SSE4.2 | ||
| SSE4a | ||
| SSSE3 | ||
| SenseMI | ||
| TBM | ||
| XFR 2 | ||
| XOP | ||
| x86-16 | ||
| x86-32 | ||
| x86-64 |
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