Combined benchmark scores for both processors
Head-to-head processor comparison
Combined benchmark scores for both processors
Out of 2,060 results in the database
Rank #456
Rank #75
Ryzen AI 9 HX 370 wins by 19.7% (Rank #456 vs #75)
Out of 2,060 results in the database
Rank #438
Rank #65
Ryzen AI 9 HX 370 wins by 19.6% (Rank #438 vs #65)
Out of 2,060 results in the database
Rank #457
Rank #138
Ryzen AI 9 HX 370 wins by 19.9% (Rank #457 vs #138)
Out of 1,771 results in the database
Rank #428
Rank #145
Ryzen AI 9 HX 370 wins by 13.3% (Rank #428 vs #145)
Out of 1,771 results in the database
Rank #326
Rank #148
Ryzen AI 9 HX 370 wins by 9.9% (Rank #326 vs #148)
Out of 1,771 results in the database
Rank #510
Rank #140
Ryzen AI 9 HX 370 wins by 14.8% (Rank #510 vs #140)
Side-by-side comparison of key specifications
| Specification | Ryzen 7 2700 | Ryzen AI 9 HX 370 | Diff |
|---|---|---|---|
| Cores |
8
|
12
|
-33.3% |
| Threads |
16
|
24
|
-33.3% |
| Base Frequency |
3,200 MHz
|
2,000 MHz
|
+37.5% |
| Clock Multiplier |
32x
|
20x
|
+37.5% |
| L1 Cache |
768 KB
|
78 KB
|
+89.9% |
| L2 Cache |
4 MiB
|
1 MiB
|
+76.2% |
| L3 Cache |
16 MiB
|
-- | |
| Memory Channels |
2
|
-- | |
| Maximum Memory |
64 GB
|
-- | |
| Max Bandwidth |
44 GB/s
|
-- | |
| Max CPUs |
1
|
-- | |
| TDP (lower is better) |
65 W
|
28 W
|
56.9% more |
| Process (lower is better) |
12 nm
|
4 nm
|
66.7% more |
| Specification | Ryzen 7 2700 | Ryzen AI 9 HX 370 |
|---|---|---|
| Designer | AMD | AMD |
| Family | Ryzen | -- |
| Series | 2000 | -- |
| Model Number | 2700 | -- |
| Microarchitecture | Zen+ | -- |
| Core Name | Pinnacle | Strix Point |
| Core Family | 23 | -- |
| Core Model | 8 | -- |
| Socket | Socket | Socket FP8 |
| Package | µOPGA-1331 | FP8 |
| Chipset | Promontory | -- |
| Memory Type | DDR4-2933 | DDR5, LPDDR5X |
| ECC Support | Yes | -- |
| Market Segment | Desktop | Mobile |
| Release Price | $299.00 | -- |
| Locked Multiplier | No | Yes |
Designer
Family
Series
Model Number
Microarchitecture
Core Name
Core Family
Core Model
Socket
Package
Chipset
Memory Type
ECC Support
Market Segment
Release Price
Locked Multiplier
Manufacturing process and die characteristics
| Specification | Ryzen 7 2700 | Ryzen AI 9 HX 370 |
|---|---|---|
| Process | 12 nm | 4 nm |
| Die Area | 213 mm² | 233 mm² |
| Transistor Count | 4.80 billion | -- |
| Manufacturer | GlobalFoundries | TSMC |
| Technology | CMOS | -- |
| Word Size | 64-bit | -- |
| ISA | x86-64 (x86) | -- |
Process
Die Area
Transistor Count
Manufacturer
Technology
Word Size
ISA
Supported instruction set extensions comparison
| Extension | Ryzen 7 2700 | Ryzen AI 9 HX 370 |
|---|---|---|
| ABM | ||
| ADX | ||
| AES | ||
| AMD-V | ||
| AMD-Vi | ||
| AVX | ||
| AVX-512 | ||
| AVX2 | ||
| BMI1 | ||
| BMI2 | ||
| Boost 2 | ||
| CLMUL | ||
| EMMX | ||
| F16C | ||
| FMA3 | ||
| FPU | ||
| MMX | ||
| NX | ||
| Protected | ||
| RdRand | ||
| Real | ||
| SHA | ||
| SMEP | ||
| SMM | ||
| SMT | ||
| SSE | ||
| SSE2 | ||
| SSE3 | ||
| SSE4.1 | ||
| SSE4.2 | ||
| SSE4a | ||
| SSSE3 | ||
| SenseMI | ||
| XFR 2 | ||
| x86-16 | ||
| x86-32 | ||
| x86-64 |
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