Combined benchmark scores for both processors
Head-to-head processor comparison
Combined benchmark scores for both processors
Out of 2,060 results in the database
Rank #340
Rank #2,055
EPYC 7302P wins by 37.7% (Rank #340 vs #2055)
Out of 2,060 results in the database
Rank #691
Rank #2,054
EPYC 7302P wins by 40.5% (Rank #691 vs #2054)
Out of 2,060 results in the database
Rank #173
Rank #2,020
EPYC 7302P wins by 34.1% (Rank #173 vs #2020)
Out of 1,771 results in the database
Rank #115
Rank #1,768
EPYC 7302P wins by 24.7% (Rank #115 vs #1768)
Out of 1,771 results in the database
Rank #122
Rank #1,770
EPYC 7302P wins by 26% (Rank #122 vs #1770)
Out of 1,771 results in the database
Rank #95
Rank #1,771
EPYC 7302P wins by 26.9% (Rank #95 vs #1771)
Side-by-side comparison of key specifications
| Specification | EPYC 7302P | Atom 230 | Diff |
|---|---|---|---|
| Cores |
16
|
1
|
+93.8% |
| Threads |
32
|
2
|
+93.8% |
| Base Frequency |
3,000 MHz
|
1,600 MHz
|
+46.7% |
| Clock Multiplier |
30x
|
12x
|
+60% |
| L1 Cache |
1,024 KB
|
56 KB
|
+94.5% |
| L2 Cache |
8 MiB
|
1 MiB
|
+93.8% |
| L3 Cache |
128 MiB
|
-- | |
| Memory Channels |
8
|
-- | |
| Maximum Memory |
4,096 GB
|
8 GB
|
+99.8% |
| Max Bandwidth |
191 GB/s
|
-- | |
| PCIe Lanes |
128
|
-- | |
| Max CPUs |
1
|
1
|
0% |
| TDP (lower is better) |
155 W
|
4 W
|
97.4% more |
| Process (lower is better) |
7 nm
|
45 nm
|
84.4% less |
| Specification | EPYC 7302P | Atom 230 |
|---|---|---|
| Designer | AMD | Intel |
| Family | EPYC | Atom |
| Series | 7002 | 200 |
| Model Number | 7302P | 230 |
| Microarchitecture | Zen 2 | Bonnell |
| Core Name | Rome | Diamondville |
| Core Family | 23 | 6 |
| Core Model | -- | 112 |
| Socket | Socket SP3 and LGA-4094 | BGA-437 |
| Package | FCLGA-4094 | FCBGA-437 |
| Chipset | -- | Calistoga |
| Memory Type | DDR4-3200 | -- |
| ECC Support | Yes | -- |
| PCIe Revision | 4.0 | -- |
| PCIe Configuration | x16, x8 | -- |
| Market Segment | Server | Mobile |
| Release Price | $825.00 | $29.00 |
| Locked Multiplier | Yes | Yes |
Designer
Family
Series
Model Number
Microarchitecture
Core Name
Core Family
Core Model
Socket
Package
Chipset
Memory Type
ECC Support
PCIe Revision
PCIe Configuration
Market Segment
Release Price
Locked Multiplier
Manufacturing process and die characteristics
| Specification | EPYC 7302P | Atom 230 |
|---|---|---|
| Process | 7 nm | 45 nm |
| Die Area | 192 mm² | 25.964 mm² |
| Transistor Count | 15,200 | 0.05 billion |
| Manufacturer | TSMC and GlobalFoundries | Intel |
| Technology | CMOS | CMOS |
| Word Size | 64-bit | 64-bit |
| ISA | x86-64 (x86) | x86-64 (x86) |
Process
Die Area
Transistor Count
Manufacturer
Technology
Word Size
ISA
Supported instruction set extensions comparison
| Extension | EPYC 7302P | Atom 230 |
|---|---|---|
| ABM | ||
| ADX | ||
| AES | ||
| AMD-V | ||
| AMD-Vi | ||
| AVX | ||
| AVX-512 | ||
| AVX2 | ||
| AVX512BW | ||
| AVX512CD | ||
| AVX512DQ | ||
| AVX512F | ||
| AVX512VL | ||
| BMI1 | ||
| BMI2 | ||
| Boost 2 | ||
| CLMUL | ||
| EIST | ||
| EMMX | ||
| EPT | ||
| F16C | ||
| FMA | ||
| FMA3 | ||
| FPU | ||
| Flex Memory | ||
| HT | ||
| IPT | ||
| KPT | ||
| MBE Ctrl | ||
| MMX | ||
| NM | ||
| NX | ||
| Node Ctrlr | ||
| PTT | ||
| Protected | ||
| RdRand | ||
| Real | ||
| Run Sure | ||
| SEV | ||
| SHA | ||
| SIPP | ||
| SME | ||
| SMEP | ||
| SMM | ||
| SMT | ||
| SSE | ||
| SSE2 | ||
| SSE3 | ||
| SSE4.1 | ||
| SSE4.2 | ||
| SSE4a | ||
| SSSE3 | ||
| SST | ||
| Secure Key | ||
| SenseMI | ||
| TBT 2.0 | ||
| TSME | ||
| TSX | ||
| TXT | ||
| VMD | ||
| VT-d | ||
| VT-x | ||
| vPro | ||
| x86-16 | ||
| x86-32 | ||
| x86-64 |
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