Combined benchmark scores for both processors
Head-to-head processor comparison
Combined benchmark scores for both processors
Out of 2,060 results in the database
Rank #595
Rank #1,962
EPYC 7302 wins by 26.9% (Rank #595 vs #1962)
Out of 2,060 results in the database
Rank #996
Rank #1,966
EPYC 7302 wins by 25.9% (Rank #996 vs #1966)
Out of 2,060 results in the database
Rank #248
Rank #1,826
EPYC 7302 wins by 28% (Rank #248 vs #1826)
Out of 1,771 results in the database
Rank #107
Rank #1,472
EPYC 7302 wins by 24.5% (Rank #107 vs #1472)
Out of 1,771 results in the database
Rank #117
Rank #1,580
EPYC 7302 wins by 25.8% (Rank #117 vs #1580)
Out of 1,771 results in the database
Rank #94
Rank #1,540
EPYC 7302 wins by 26.1% (Rank #94 vs #1540)
Side-by-side comparison of key specifications
| Specification | EPYC 7302 | A8-4555M | Diff |
|---|---|---|---|
| Cores |
16
|
2
|
+87.5% |
| Threads |
32
|
4
|
+87.5% |
| Base Frequency |
3,000 MHz
|
2,600 MHz
|
+13.3% |
| Clock Multiplier |
28x
|
16x
|
+42.9% |
| L1 Cache |
1,024 KB
|
-- | |
| L2 Cache |
8 MiB
|
4 MiB
|
+52.3% |
| L3 Cache |
128 MiB
|
-- | |
| Memory Channels |
8
|
2
|
+75% |
| Maximum Memory |
4,096 GB
|
0 GB
|
+100% |
| Max Bandwidth |
191 GB/s
|
26 GB/s
|
+86.6% |
| PCIe Lanes |
128
|
4
|
+96.9% |
| Max CPUs |
2
|
1
|
+50% |
| TDP (lower is better) |
155 W
|
65 W
|
58.1% more |
| Process (lower is better) |
7 nm
|
65 nm
|
89.2% less |
| Specification | EPYC 7302 | A8-4555M |
|---|---|---|
| Designer | AMD | AMD |
| Family | EPYC | -- |
| Series | 7002 | -- |
| Model Number | 7302 | E4700 |
| Microarchitecture | Zen 2 | -- |
| Core Name | Rome | Trinity |
| Core Family | 23 | -- |
| Socket | Socket SP3 and LGA-4094 | PLGA775 |
| Package | FCLGA-4094 | µPGA |
| Memory Type | DDR4-3200 | DDR3L 1333 |
| ECC Support | Yes | No |
| PCIe Revision | 4.0 | 2.0 |
| PCIe Configuration | x16, x8 | X4, X2, X1 |
| Market Segment | Server | Mobile |
| Release Price | $978.00 | -- |
| Locked Multiplier | Yes | Yes |
Designer
Family
Series
Model Number
Microarchitecture
Core Name
Core Family
Socket
Package
Memory Type
ECC Support
PCIe Revision
PCIe Configuration
Market Segment
Release Price
Locked Multiplier
Manufacturing process and die characteristics
| Specification | EPYC 7302 | A8-4555M |
|---|---|---|
| Process | 7 nm | 65 nm |
| Die Area | 192 mm² | 246 mm² |
| Transistor Count | 15,200 | 1,303 |
| Manufacturer | TSMC and GlobalFoundries | GlobalFoundries |
| Technology | CMOS | -- |
| Word Size | 64-bit | 64-bit |
| ISA | x86-64 (x86) | -- |
Process
Die Area
Transistor Count
Manufacturer
Technology
Word Size
ISA
Integrated GPU specifications comparison
| Specification | EPYC 7302 | A8-4555M |
|---|---|---|
| GPU | -- | HD Graphics |
| GPU Designer | -- | Intel |
| GPU Max Frequency | -- | 854 MHz |
GPU
GPU Designer
GPU Max Frequency
Supported instruction set extensions comparison
| Extension | EPYC 7302 | A8-4555M |
|---|---|---|
| ABM | ||
| ADX | ||
| AES | ||
| AMD-V | ||
| AMD-Vi | ||
| AVX | ||
| AVX-512 | ||
| AVX2 | ||
| AVX512BW | ||
| AVX512CD | ||
| AVX512DQ | ||
| AVX512F | ||
| AVX512VL | ||
| AVX512_VNNI | ||
| BMI1 | ||
| BMI2 | ||
| Boost 2 | ||
| CLMUL | ||
| DL Boost | ||
| EIST | ||
| EMMX | ||
| EPT | ||
| F16C | ||
| FMA | ||
| FMA3 | ||
| FMA4 | ||
| FPU | ||
| Flex Memory | ||
| HT | ||
| IPT | ||
| KPT | ||
| MBE Ctrl | ||
| MMX | ||
| NM | ||
| NX | ||
| Node Ctrlr | ||
| PTT | ||
| Protected | ||
| RdRand | ||
| Real | ||
| Run Sure | ||
| SEV | ||
| SHA | ||
| SIPP | ||
| SME | ||
| SMEP | ||
| SMM | ||
| SMT | ||
| SSE | ||
| SSE2 | ||
| SSE3 | ||
| SSE4.1 | ||
| SSE4.2 | ||
| SSE4a | ||
| SSSE3 | ||
| SST | ||
| Secure Key | ||
| SenseMI | ||
| TBM | ||
| TBT 2.0 | ||
| TSME | ||
| TSX | ||
| TXT | ||
| VMD | ||
| VT-d | ||
| VT-x | ||
| XOP | ||
| vPro | ||
| x86-16 | ||
| x86-32 | ||
| x86-64 |
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